China EMS zothetsera kwa Printed Circuit Board Manufacturer ndi Supplier |Kukumba migodi

EMS zothetsera kwa Printed Circuit Board Featured Image

EMS mayankho kwa Printed Circuit Board

Monga wothandizira zamagetsi (EMS), Minewing imapereka ntchito za JDM, OEM, ndi ODM kwa makasitomala padziko lonse lapansi kuti apange bolodi, monga bolodi yomwe imagwiritsidwa ntchito panyumba zanzeru, zowongolera mafakitale, zida zovala, ma beacon, ndi zamagetsi zamakasitomala.Timagula zida zonse za BOM kuchokera kwa wothandizira woyamba wa fakitale, monga Future, Arrow, Espressif, Antenova, Wasun, ICKey, Digikey, Qucetel, ndi U-blox, kuti tisunge khalidweli.Titha kukuthandizani pakupanga ndi chitukuko kuti tikupatseni upangiri waukadaulo pakupanga, kukhathamiritsa kwazinthu, ma prototypes mwachangu, kukonza zoyeserera, ndi kupanga misa.Timadziwa kupanga ma PCB ndi njira yoyenera yopangira.

Titumizireni imelo

Tsatanetsatane wa Utumiki

Ma tag a Service

Kufotokozera

Zokhala ndi chipangizo cha SPI, AOI, ndi X-ray cha mizere 20 ya SMT, 8 DIP, ndi mizere yoyesera, timapereka ntchito zapamwamba zomwe zimaphatikizapo njira zambiri zolumikizirana ndikupanga PCBA yamagulu angapo, PCBA yosinthika.Laborator yathu yaukadaulo ili ndi ROHS, drop, ESD, ndi zida zapamwamba & zotsika zoyezera kutentha.Zogulitsa zonse zimaperekedwa ndi kuwongolera kokhazikika.Pogwiritsa ntchito makina apamwamba a MES pakuwongolera zopanga pansi pa IAF 16949 muyezo, timagwira ntchito moyenera komanso motetezeka.
Mwa kuphatikiza zothandizira ndi mainjiniya, titha kuperekanso mayankho a pulogalamuyi, kuyambira pakupanga pulogalamu ya IC ndi mapulogalamu mpaka kapangidwe kamagetsi kamagetsi.Pokhala ndi chidziwitso pakupanga mapulojekiti azachipatala komanso zamagetsi zamakasitomala, titha kutenga malingaliro anu ndikupangitsa kuti zinthu zenizeni zikhale zamoyo.Popanga mapulogalamu, pulogalamu, ndi bolodi lokha, tikhoza kuyang'anira ndondomeko yonse yopangira bolodi, komanso zinthu zomaliza.Chifukwa cha fakitale yathu ya PCB ndi mainjiniya, imatipatsa mwayi wopikisana poyerekeza ndi fakitale wamba.Kutengera kapangidwe kazinthu & gulu lachitukuko, njira yokhazikitsidwa yopangira zinthu zosiyanasiyana, komanso kulumikizana kothandiza pakati pa mayendedwe operekera, tili ndi chidaliro chokumana ndi zovuta ndikumaliza ntchitoyo.

PCBA luso
Zida zokha	Kufotokozera
Makina ojambulira laser PCB500	Kuyika chizindikiro: 400 * 400mm
	Liwiro: ≤7000mm/S
	Mphamvu yayikulu: 120W
	Q-kusintha, Udindo wa Ntchito: 0-25KHZ;0-60%
Makina osindikizira a DSP-1008	Kukula kwa PCB: MAX: 400 * 34mm MIN: 50 * 50mm T: 0.2 ~ 6.0mm
	Kukula kwa stencil: MAX: 737 * 737mm Kukula: 420 * 520mm
	Kuthamanga kwa scraper: 0.5 ~ 10Kgf / cm2
	Njira yoyeretsera: Kupukuta kowuma, kuyeretsa konyowa, kutsuka pavuvu (lokonzekera)
	Liwiro losindikiza: 6 ~ 200mm/mphindi
	Kulondola kosindikiza: ± 0.025mm
SPI	Mfundo yoyezera: 3D White Light PSLM PMP
	Chinthu choyezera: Voliyumu ya Solder paste, dera, kutalika, XY offset, mawonekedwe
	Kusintha kwa lens: 18um
	Kulondola: XY kusamvana: 1um; Kuthamanga kwakukulu: 0.37um
	Kukula kwa mawonekedwe: 40 * 40mm
	Liwiro la FOV: 0.45s/FOV
Makina othamanga a SMT SM471	Kukula kwa PCB: MAX: 460 * 250mm MIN: 50 * 40mm T: 0.38 ~ 4.2mm
	Chiwerengero cha ma shafts okwera: 10 spindles x 2 cantilevers
	Kukula kwagawo: Chip 0402(01005 inchi) ~ □14mm(H12mm) IC,Cholumikizira(lead phula 0.4mm),※BGA,CSP(Tin ball spacing 0.4mm)
	Kukwera kolondola: chip ± 50um@3ó/chip, QFP ± 30um@3ó/chip
	Liwiro lokwera: 75000 CPH
Makina othamanga a SMT SM482	Kukula kwa PCB: MAX: 460 * 400mm MIN: 50 * 40mm T: 0.38 ~ 4.2mm
	Chiwerengero cha ma shafts okwera: 10 spindles x 1 cantilever
	Kukula kwagawo: 0402(01005 inchi) ~ □16mm IC,Cholumikizira(lead phula 0.4mm),※BGA,CSP(Tin ball spacing 0.4mm)
	Kukwera kolondola: ± 50μm@μ+3σ (malinga ndi kukula kwa chip)
	Liwiro lokwera: 28000 CPH
HELLER MARK III Ng'anjo ya nayitrogeni reflux	Malo: Magawo 9 otentha, 2 malo ozizira
	Gwero la kutentha: Mpweya wotentha
	Kuwongolera kutentha: ± 1 ℃
	Kuchuluka kwa chipukuta misozi: ± 2 ℃
	Kuthamanga kwa orbital: 180-1800mm / min
	M'lifupi mwake: 50-460mm
AOI ALD-7727D	Mfundo yoyezera: Kamera ya HD imapeza mawonekedwe a gawo lililonse la kuwala kwamitundu itatu komwe kumawunikira pa bolodi la PCB, ndikuyiweruza pofananiza chithunzi kapena magwiridwe antchito a imvi ndi RGB pa mfundo iliyonse ya pixel.
	Chinthu choyezera: Zolakwika zosindikizira za Solder paste, zolakwika za magawo, zolakwika zolumikizana za solder
	Kusintha kwa lens: 10um
	Kulondola: XY kusamvana: ≤8um
3D X-RAY AX8200MAX	Kukula kwakukulu kozindikira: 235mm * 385mm
	Mphamvu yayikulu: 8W
	Mphamvu yamagetsi: 90KV/100KV
	Kuyikira Kukula: 5μm
	Chitetezo (mlingo wa radiation): ＜1uSv/h
Wave soldering DS-250	PCB m'lifupi: 50-250mm
	PCB kufala kutalika: 750 ± 20 mm
	Kuthamanga liwiro: 0-2000mm
	Kutalika kwa preheating zone: 0.8M
	Chiwerengero cha zone yotenthetsera: 2
	Nambala yoweyula: Mafunde apawiri
Makina a board splitter	Ntchito zosiyanasiyana: MAX: 285 * 340mm MIN: 50 * 50mm
	Kudula mwatsatanetsatane: ± 0.10mm
	Kudula liwiro: 0 ~ 100mm / S
	Kuthamanga kwa kuzungulira kwa spindle: MAX: 40000rpm

Technology luso
Nambala	Kanthu	Kuthekera kwakukulu
1	zinthu zoyambira	Normal Tg FR4, High Tg FR4, PTFE, Rogers, Low Dk/Df etc.
2	Mtundu wa chigoba cha solder	wobiriwira, wofiira, wabuluu, woyera, wachikasu, wofiirira, wakuda
3	Mtundu wa nthano	woyera, wachikasu, wakuda, wofiira
4	Pamwamba mankhwala mtundu	ENIG, malata omiza, HAF, HAF LF, OSP, golide wonyezimira, chala chagolide, siliva wonyezimira
5	Max.kusanjikiza (L)	50
6	Max.kukula kwa unit (mm)	620813 (24"32")
7	Max.kukula kwa gulu (mm)	620*900 (24"x35.4")
8	Max.makulidwe a board (mm)	12
9	Min.makulidwe a board (mm)	0.3
10	Kulekerera makulidwe a board (mm)	T<1.0 mm: +/-0.10mm;T≥1.00mm: +/-10%
11	Kulolera kulembetsa (mm)	+/-0.10
12	Min.makina kubowola m'mimba mwake (mm)	0.15
13	Min.laser kubowola m'mimba mwake(mm)	0.075
14	Max.mbali (kupyolera mu dzenje)	15:1
	Max.mbali (micro-via)	1.3:1
15	Min.m'mphepete mwa dzenje kupita kumalo amkuwa (mm)	L≤10, 0.15;L=12-22,0.175;L=24-34, 0.2;L=36-44, 0.25;L＞44, 0.3
16	Min.chilolezo chamkati (mm)	0.15
17	Min.m'mphepete mwa dzenje mpaka m'mphepete mwa dzenje (mm)	0.28
18	Min.dzenje m'mphepete mpaka malo a mzere wa mbiri (mm)	0.2
19	Min.mkuwa wamkati mpaka mbiri ya sapce (mm)	0.2
20	Kuloledwa kulembetsa pakati pa mabowo (mm)	± 0.05
21	Max.kumaliza mkuwa makulidwe (um)	Mtundu Wakunja: 420 (12oz) Mkati mwake: 210 (6oz)
22	Min.kufufuza m'lifupi (mm)	0.075 (3mil)
23	Min.kufufuza malo (mm)	0.075 (3mil)
24	Makulidwe a chigoba cha solder (um)	Ngodya ya mzere: > 8 (0.3mil) Pamkuwa:> 10 (0.4mil)
25	ENIG golide makulidwe (um)	0.025-0.125
26	ENIG makulidwe a nickle (um)	3-9
27	Sterling silver makulidwe (um)	0.15-0.75
28	Min.HAL makulidwe a malata (um)	0.75
29	Kumizidwa kwa malata (um)	0.8-1.2
30	Kukhuthala kwa golide wokhuthala (um)	1.27-2.0
31	Kukhuthala kwa chala chagolide (um)	0.025-1.51
32	golden chala plating nickle makulidwe (um)	3-15
33	makulidwe a golide wonyezimira (um)	0,025-0.05
34	makulidwe a nickle wonyezimira wagolide (um)	3-15
35	kukula kwa mbiri (mm)	± 0.08
36	Max.kukula kwa dzenje la solder (mm)	0.7
37	BGA pansi (mm)	≥0.25 (HAL kapena HAL Yaulere: 0.35)
38	Kulekerera kwa tsamba la V-CUT (mm)	+/-0.10
39	Kulekerera kwa V-CUT (mm)	+/-0.10
40	Kulekerera kwa bevel angle yagolide (^o)	+/-5
41	Kulekerera kwa Impedence (%)	+/- 5%
42	Kulekerera kwa Warpage (%)	0.75%
43	Min.kukula kwa nthano (mm)	0.1
44	Moto woyaka moto	94v-0
Zapadera za Via mu pad mankhwala	Kukula kwa dzenje lomata utomoni (min.) (mm)	0.3
	Kukula kwa dzenje (max.) (mm)	0.75
	makulidwe a bolodi lomangika (min.) (mm)	0.5
	Makulidwe a bolodi lolumikizidwa ndi utomoni (max.) (mm)	3.5
	Resin plugged maximum aspect ratio	8:1
	Utoto unamata bowo pang'ono pa bowo (mm)	0.4
	Kodi mungasiyanitse kukula kwa bowo pa bolodi limodzi?	inde
Bwalo la ndege lakumbuyo	Kanthu
	Max.kukula kwa pnl (kumaliza) (mm)	580*880
	Max.kukula kwa gulu (mm)	914 × 620
	Max.makulidwe a board (mm)	12
	Max.kusanjikiza (L)	60
	Mbali	30:1 (Min. dzenje: 0.4 mm)
	Mzere waukulu/danga (mm)	0.075/ 0.075
	Kukhoza kubowola kumbuyo	Inde
	Kulekerera kubowola kumbuyo (mm)	± 0.05
	Kulekerera kwa mabowo osindikizira (mm)	± 0.05
	Pamwamba mankhwala mtundu	OSP, siliva wokongola, ENIG
Rigid-flex board	Kukula kwa dzenje (mm)	0.2
	Makulidwe a dielectrical (mm)	0.025
	Kukula kwa gulu logwirira ntchito (mm)	350x500
	Mzere waukulu/danga (mm)	0.075/ 0.075
	Wolimba	Inde
	Flex board layers (L)	8 (4plys of flex board)
	Ma board olimba (L)	≥14
	Chithandizo chapamwamba	Zonse
	Flex board mkati kapena kunja wosanjikiza	Onse
Zapadera pazogulitsa za HDI	Kukula kwa dzenje la laser (mm)	0.075
	Max.makulidwe a dielectric (mm)	0.15
	Min.makulidwe a dielectric (mm)	0.05
	Max.mbali	1.5:1
	Kukula kwa Pad Pansi (pansi pa micro-via) (mm)	Kukula kwa dzenje + 0.15
	Pamwamba Pad kukula (pa micro-via) (mm)	Kukula kwa dzenje + 0.15
	Kudzaza mkuwa kapena ayi (inde kapena ayi) (mm)	inde
	Kudzera pamapangidwe a Pad kapena ayi (inde kapena ayi)	inde
	Utoto wokwiriridwa m'bowo wolumikizidwa (inde kapena ayi)	inde
	Min.kudzera kukula akhoza kudzazidwa mkuwa (mm)	0.1
	Max.nthawi stack	wosanjikiza uliwonse

Zam'mbuyo: Integrated wopanga lingaliro lanu kupanga

Ena: Mayankho a Systems Integration a Chizindikiritso chanzeru